AMD previewed its Instinct MI300 accelerator at CES on 4 January, bringing CPU, GPU and high-bandwidth memory chiplets into a single data-centre design. The company is targeting high-performance computing and AI workloads with a package that combines Zen 4 CPU cores and CDNA 3 graphics architecture.
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Lisa Su showed the physical chip during the keynote. ServeTheHome’s event report says AMD plans availability in the second half of 2023. That is a future release window; the CES presentation is a preview.
Moving computing closer to memory
AMD’s June 2022 roadmap described CDNA 3 as combining 5nm chiplets, three-dimensional stacking and high-bandwidth memory with a unified memory programming model. The aim is to bring CPU and GPU work into a more closely integrated package rather than treating each processor as a separate island.
The roadmap’s performance forecasts were preliminary engineering estimates, with final performance subject to change. They do not establish how shipping systems will perform on a particular AI workload.
The CES disclosure adds physical silicon and packaging details to that earlier roadmap. ServeTheHome reports nine 5nm chiplets stacked over four 6nm chiplets, with 128GB of HBM3 memory and 146 billion transistors.
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